星期三, 4月 30, 2025

EX#9 3d model

1. text-to-3d

2. 使用街景照片製作 3d 模型

使用Claude Sonnet 3.7 將場景照片轉為3D 模型，使用第一人稱視角，須具備 React 互動操作特性

增加碰撞偵測，碰撞阻止

增加物件互動(玩具靠近會招手...)

圖庫

星期三, 4月 23, 2025

物理模擬

react.js

學生優秀作品觀摩

星期二, 4月 22, 2025

EX#8 Visual Learning

1. 製作印歐語系"母親"("父親"，"眼睛"，"雪")的演進

(參考 "百"的演進 )

2. 電子系的科技英文 remix ex:半導體元件的科技英文

科學英文 remix ex:量子力學的科技英文

以上二者任選一項

3. 參考郵票設計，選擇下列一項

製作薛丁格方程式 100 周年紀念郵票

哥白尼 550 周年紀念郵票

愛因斯坦 70 周年紀念郵票

或你喜歡人物的紀念郵票(藝術家，演員，歌手，...)，任選一項

4. 3D 物理模擬

參考以下水與冰的相變，製作一個3D物理模擬

結冰

3D icing

share (quantum level)

雪花

星期日, 4月 20, 2025

Semiconductor Component Transfer

code share

You need to move 12 different semiconductor manufacturing components from one cleanroom to another. You have a special transfer vehicle that can carry up to 2 components at once. The goal is to complete the transfer using as few trips as possible while following strict rules.

The Extreme Challenge Rules: 1. Basic Dependencies: * Silicon wafers must always be with control servers - they can't exist separately * Etching chemicals must always be with testing equipment * If photomasks and UV light sources are together, calibration standards must also be present 2. Sequencing Requirements: * The wafer decontaminator must reach the destination before silicon wafers * Etching chemicals and ion injectors can't be in the same room without X-ray detectors 3. Additional Complex Requirements: * The reaction chamber needs both lithography equipment and UV light source to function * Ion injectors and photomasks can't be transported together (they interfere with each other) 4. Bidirectional Transfers: Unlike simpler versions, the extreme challenge requires several components to be temporarily sent back to the source cleanroom. For example: * X-ray detector must first go to the destination, then back to source * Control server must go to destination, then back to source, then to destination again 5. Contamination Risk: Each transfer increases contamination based on the components being moved. Some components have higher contamination risk than others. If total contamination reaches 100%, the transfer fails.

Semiconductor Component Transfer Solution

Let's create a step-by-step plan that minimizes trips while respecting all dependencies, sequencing requirements, and bidirectional transfer requirements.

Optimal Transfer Solution (10 trips)

Trip 1: Move Wafer Decontaminator and Lithography Equipment to destination

Note: Wafer decontaminator must be at destination before silicon wafers

Trip 2: Move X-ray Detector and UV Light Source to destination

Note: X-ray detector begins its required path (source→destination→source)

Trip 3: Move X-ray Detector and UV Light Source back to source

Note: X-ray detector continues its required path

omitted

Trip 8: Move UV Light Source and Photomasks to destination

Note: Photomasks and UV light source are now together with calibration standards

Trip 9: Move Etching Chemicals and Testing Equipment to destination

Note: These components must travel together

Trip 10: Move Ion Injectors and Reaction Chamber to destination

Note: X-ray detector is already at destination, allowing ion injectors and etching chemicals to be in the same room

Verification of Rules

Basic Dependencies:
- Silicon wafers and control servers are always together ✓
- Etching chemicals and testing equipment are always together ✓
- Photomasks, UV light sources, and calibration standards end up together ✓
Sequencing Requirements:
- Wafer decontaminator reaches destination before silicon wafers ✓
- Etching chemicals and ion injectors are never in the same room without X-ray detectors ✓
Complex Requirements:
- Reaction chamber, lithography equipment, and UV light source all end up at destination ✓
- Ion injectors and photomasks are never transported together ✓
Bidirectional Transfers:
- X-ray detector: source → destination → source → destination ✓
- Control server: source → destination → source → destination ✓